DESY Test Beam Telescope – TelePix

TelePix HVCMOS Sensor: Advancing the DESY Telescope Upgrade


We have developed the TelePix HVCMOS sensor, a large-scale detector designed to enhance the performance of the DESY test beam telescope. This next-generation sensor improves upon older designs with higher spatial resolution (165 µm × 25 µm pixel size) and a time resolution of 2.4 ns, enabling precise, low-latency trigger signal generation.

Layout of TelePix sensor chip


Key Features

  • Ultra-Fast Timing: 2.4 ns resolution for real-time particle hit detection.
  • High Granularity: 120 × 400 pixel matrix (19.8 cm × 1.0 cm active area).
  • Advanced Circuitry: Integrated isolated PMOS transistors and full-swing CMOS comparators for robust signal integrity.
  • Radiation Hardness: Sustained >99% efficiency under extreme radiation exposure.

Purpose


TelePix is optimized to deliver rapid, low-latency trigger signals essential for the DESY telescope. Its precision timing and spatial resolution ensure accurate particle track reconstruction.


Validated Performance

  • Time resolution: 2.4 ns (benchmarked post-irradiation).
  • Pixel granularity: 48,000 pixels with 165 µm × 25 µm pitch.
  • Radiation tolerance: Maintains >99% detection efficiency even after irradiation doses of 10¹⁵ neq/cm².